This is a two-half-day workshop, taking place on 23-24 April 2024. The workshop will take place in a hybrid mode where you can join either onsite at Thales Research and Technology (1 Av. Augustin Fresnel, 91120 Palaiseau, France) or online via online streaming.

Please fill in our satisfaction survey here.

Disclaimer: we are in the process of preparing a certificate of attendance for all participants. If you need one urgently please get in touch with us through info@epixfab.eu

Schedule
TUESDAY APRIL 23rd
Timeslot Topic Speaker
12:00 – 13:00

Light Lunch

 
13:00 – 13:30 Welcome and introduction to the workshop Wim Bogaerts (UGent-imec, ePIXfab),
Gilles Feugnet (Thales),
Hamed Sattari (CSEM)
Sergii Gudyriev (X-FAB)
13:30 – 14:00 Mainstream integrated photonics platforms:
Silicon Photonics (SOI and SiN)
Roel Baets (UGent-imec)
14:00 – 14:30 Mainstream integrated photonics platforms:
III-V Photonics (InP and other III-V materials)

Thomas Mérelle (III-V Labs)

14:30 – 15:00 Large-volume heterogeneous integration

Sergii Gudyriev (X-Fab)

15:00 – 15:30

Coffee break  
15:30 – 16:00 Emerging integrated photonic platforms:
a thin film LNOI PIC platform
Hamed Sattari (CSEM)
16:00 – 16:30 Emerging integrated photonic platforms:
a BTO-based PIC platform

Clarissa Convertino (Lumiphase)

16:30 – 17:00 Emerging integrated photonic platforms:
silicon photonic MEMS
Kristinn Gylfason (KTH)
17:00 – 17:30

Non-linear integrated photonics using
emerging PIC platforms

Camille Bres (EPFL/CSEM)

17:30 – 18:30 Apéritif  
18:30 –

Dinner

 
Wednesday April 24th
Timeslot Topic Speaker
8:30 – 9:10 Heterogeneous integration techniques Gunther Roelkens (UGent-imec)
9:10 – 9:35 Choices and challenges for developing a
process flow for heterogeneous integration
Joan Ramirez (III-V labs)
9:35 – 10:00

Integrating new materials onto SOI and SiN
photonics: from 2D materials to perovskites

Rijil Thomas (AMO)

10:00 – 10:30

Coffee break

 
10:30 – 10:55

Design Challenges associated with
heterogeneous integration

Pieter Dumon (Luceda Photonics)

10:55 – 11:20

Hybrid Integration of High-Speed InP PICs

Patrick Runge (HHI)

11:20 – 11:45

Packaging challenges associated with
heterogeneous integration

Joost van Kerkhof (PHIX)
11:45 – 12:15 Panel discussion

Joan Ramirez (III-V labs)

Pieter Dumon (Luceda Photonics)

Joost van Kerkhof (PHIX)

Sergii Gudyriev (X-Fab)

Wim Bogaerts (UGent-imec, ePIXfab),
Gilles Feugnet (Thales)

12:15 – 12:30

Closing remarks

Wim Bogaerts (UGent-imec, ePIXfab)

12:30 – 13:30

Standing lunch

 
     

 

Practical information

When?

23-24 April
12PM - 13PM

Where

Thales Research and Technology, 1 Av. Augustin Fresnel, 91120 Palaiseau, France

Fee
  • Reduced rate: 130 Euro for Elena, Pattern, Phormic, and photonixFAB project partners
  • Regular rate: 200 Euro

Partners

Mainstream integrated photonics platforms: Silicon Photonics (SOI and SiN)

 

Prof. Roel Baets

Ghent University – imec, Belgium

Emerging integrated photonics platforms: Thin film LNOI PIC platform

 

Dr. Hamed Sattari

CSEM, Switzerland

Emerging integrated photonics platforms: Silicon photonics MEMS

 

Prof. Kristinn Gylfason

KTH, Sweden

Heterogeneous integration techniques

 

Prof. Gunther Roelkens

Ghent University – imec, Belgium

Mainstream integrated photonics platforms: III-V Photonics (InP and other III-V materials)

 

Dr. Thomas Mérelle

III-V labs, France

Heterogeneous platforms in the industry

 

Dr. Sergii Gudyriev

X-FAB

Emerging integrated photonic platforms: a BTO-based PIC platform

 

Lucas Güniat

Lumiphase

Non-linear integrated photonics using emerging PIC platforms

 

Prof. Camille-Sophie Brès

EPFL, Switzerland

Choices and challenges for developing a process flow for heterogeneous integration

 

Dr. Joan Manel Ramírez

III-V labs

Exotic integrated photonic platforms: Perovskites, graphene/2D or colloidal quantum dots on SOI/SiN PICs

 

Dr. Rijil Thomas

AMO GmbH

Design Challenges associated with heterogeneous integration

 

Dr. Pieter Dumon

Luceda Photonics

Hybrid Integration of High-Speed InP PICs

 

Dr. Patrick Runge

Heinrich Hertz Institute, Germany

Packaging challenges associated with heterogeneous integration

 

Dr. Joost Van Kerkhof

PHIX Photonics Assembly