Silicon photonic integrated circuits have allowed for incredible advances in a number of fields, including LiDAR, signal processing, sensors, and data transmission, in part due to the manufacturability of CMOS compatible processes. However, silicon is a poor light emitter, and the integration of compound semiconductor lasers with silicon photonics remains a common challenge.
The SiEPICfab-ePIXfab Workshop on Laser Integration in Silicon Photonics brings together experts in various fields to discuss the most promising approaches of laser integration and the applications that will be enabled by this capability. Participation in experimental MPWs using two of these approaches (transfer printing and photonic wire bonding) will be offered as an option in this workshop
Dates: November 15 to November 18, 2021: 5 PM (CET) / 8 AM (PST) and will end at 7 PM (CET) / 10 AM (PST)
The experimental MPW is for scientific evaluation and it will provide a low TRL implementation of laser integration with silicon photonics chips.
15-18
November
17PM - 19PM
Early Bird Registration Rates (valid till 10.10.2021)
ePIXfab and SiEPICfab members get a 20% discount.
All rates will increase by 10% after 10.10.2021. All rates exclude MPW participation costs.
In case of difficulties in registering, contact: Dr. Abdul Rahim (abdul.rahim@epixfab.eu) or Mr. Steven Gou (steven.gou@ubc.ca)
University of California Santa Barbara, USA
LioniX International, the Netherlands
INTEL, USA
Ghent University – imec, Belgium
Institute of Technology, Germany
DARPA, USA
Rockley Photonics, UK/USA
Tower Semiconductor, USA
SiLC Technologies, Inc, USA
University of British Columbia, Canada
NTT, Japan
SCINTIL Photonics/ University of Toronto, Canada